The Series A financing of this Nanjing-based enterprise has been successfully concluded, adding another powerful player to the domestic high-end packaging materials market

Recently, Nanjing Juding Core Materials announced the completion of its Series A financing round, which was exclusively strategically invested by Changxin Industrial Investment.

This round of financing not only injects strong development momentum into this enterprise that focuses on the research and production of underfill materials for integrated circuit packaging, but also reflects the in-depth layout of capital in the localization of key semiconductor materials.

The core products of Juding Core Materials – conductive adhesives and insulating adhesives – may seem like “supporting roles” in chip packaging, but in fact, they play a crucial role, directly affecting the mechanical strength, thermal conductivity and signal transmission stability of the packaging structure.

With the soaring performance requirements for chips in high-end scenarios such as 5G, AI, and automotive electronics, traditional materials have become inadequate to meet the demands, and the domestic substitution of high-end surface mount adhesives is an urgent matter.

According to industry data, the global market size of semiconductor packaging materials exceeded 20 billion US dollars in 2023, among which there is still considerable room for the domestic production rate of high-end underfill materials.

The technological breakthrough of Juding Core Materials precisely hits this link.

Behind the financing lies the profound accumulation of Juding Core Materials in the field of materials science.

For many years, the company has been dedicated to the research and development and production of underfill materials for integrated circuit packaging. Its products are widely used in semiconductor IC packaging, LED, smart phones and automotive electronics, among other fields.

This exclusive investment by Changxin Industrial Investment will help the enterprise further promote the innovation and industrialization of high-end surface mount adhesive technology.

Journalists have sorted out and found that in recent years, the localization of semiconductor materials has become a “hard technology” track pursued by capital.

In 2023 alone, more than 10 domestic packaging material enterprises received financing, covering multiple sub-sectors such as photoresist, bonding wire, and plastic packaging materials.

In the global competition of semiconductors, the financing story of Juding Core Materials is injecting a strong heartening shot into the industry. The path of independent control for China’s semiconductor industry is bound to become wider and wider.