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On the afternoon of June 26, a “on-chain party” with the theme of “chip-level thermal conductivity and packaging functional materials” was held in Lishui Development Zone. As a brand of market supply and demand docking activities focused on by Nanjing Bureau of Industry and Information Technology, “Ninggong Product Push” took 18 key enterprises in the field of electronics and integrated circuits to enter Nanjing Abner New Materials Co., LTD., and carried out a “two-way rush” of the upstream and downstream of the industrial chain.
“After AI computing power goes up, heat dissipation is a big pain point. The AI computing power array thermal conductive material, graphene thermal conductive gasket, and thermal conductive structure adhesive that we bring today are specifically to solve the key problem of ‘heat’.” At the beginning of the event, the host, Nanjing Abner, directly presented its list of innovative products and businesses.
