Two billion yuan! “Increase holdings” in Nanjing

Recently, Huatian Technology, a leading enterprise in China’s semiconductor packaging and testing field, announced that it would integrate its three core business segments and invest 2 billion yuan to establish Nanjing Huatian Advanced Packaging Co., Ltd. in Pukou Economic Development Zone. This is another crucial move made by Huatian, which has been heavily investing in Nanjing for seven consecutive years.

As the core carrier area of Nanjing’s integrated circuit industry, Pukou, relying on its geographical advantages and industrial foundation, has formed a complete industrial chain ecosystem covering IC design, wafer manufacturing, packaging and testing, and material support.
The Pukou Economic Development Zone has gathered over 300 enterprises in the upstream and downstream of the integrated circuit industry. In the first half of this year, the integrated circuit industry in the park achieved a production value of 13.988 billion yuan, an increase of 8.55% year-on-year. Twelve new industrial chain projects were signed, among which four projects had an investment of over 500 million yuan.

Explore effective paths for domestic substitution from scratch

In recent years, China’s integrated circuit industry has shown a vigorous development trend, and an industrial leap from “following” to “taking the lead” is accelerating.
In the current era of rapid growth in the global advanced packaging market, as the sixth largest and the third largest in China among integrated circuit packaging and testing manufacturers, Huatian Technology is actively exploring effective paths for domestic substitution and breaking through in this computing power competition with its “core” quality productivity.

Since its establishment, Huatian Advanced has set its sights on advanced packaging and testing businesses such as 2.5D/3D. 2.5D/3D, in layman’s terms, is about seeking answers from space. By stacking chips, it achieves performance comparable to that of advanced process chips. The shorter transmission path leads to lower power consumption and thus stronger performance.
Huatian Advanced has simultaneously laid out both imported and domestic production lines. Through technological benchmarking, it collaborates with equipment and material suppliers for research and development, optimizes performance, and ultimately achieves a leapfrog development.

“Pure domestic 2.5D/3D advanced packaging and testing technology is still a blank in China. What Huatian’s domestic production line does is to break through from zero, especially in terms of the reliability, yield and stability of high-end plastic sealing materials, in order to reduce the dependence on foreign materials and equipment, replace advanced products and avoid being ‘strangled’.” ” Zhu Yuping, the deputy general manager of Huatian Technology (Nanjing) Co., LTD., said that even though this path is full of difficulties and requires a lot of time and effort, Huatian is confident that it can gain the right to speak in domestic production.
The enterprise has done a lot of preparatory work in advance. Currently, the import line has been successfully run in the second quarter. In the second half of the year, the construction and debugging of the domestic line will be completed, and small-scale sample tests will be conducted.

The multi-point blooming packaging and testing technology is more intelligent and efficient

In the field of advanced packaging and testing, Huatian has long made plans. Recently, a reporter visited the advanced packaging and testing project site of Pangu Semiconductor located in Pukou Economic Development Zone. A white building stood before the eyes, and a batch of transport vehicles loaded with the latest production equipment slowly drove into the factory building. The first phase of this project has been completed and is currently in the stage of small-scale product trial production.

“Pangu, meaning the creation of the world, represents a change for Huatian.” ” The person in charge of the project introduced that the Pangu project is a kind of “dimensional reduction strike” to traditional packaging. It uses a higher degree of automation and lower cost to carry out a technological revolution in traditional packaging.
The Pangu project is Huatian’s exploration of a higher field of advanced domestic packaging and testing. The localization rate of its production equipment is also particularly high. It will develop high-utilization glass substrates to enhance the utilization rate of chips during secondary layout, which can not only save space and reduce power consumption, but also improve data transmission efficiency.

The first phase of the Huatian Nanjing Advanced Integrated Circuit Packaging and Testing Industrial Base project, which was the first to make a move, focuses on storage and mobile terminals. Its product processes include BGA, LGA, DFN, QFN, FC, MEMS, Memory and other packaging.
In 2021, the wafer-level advanced packaging and testing base project invested by Huatian Jiangsu will be built into an international leading level integrated circuit wafer-level Gold Bump packaging and testing production line, a high-pixel image sensor packaging and testing production line, and an integrated circuit wafer-level packaging and testing production line.

More intelligent packaging and testing solutions will also be realized in the near future

In July, Huatian Technology signed a cooperation agreement with a leading enterprise in the “AI+ robotics” field on the Huazhi Body-based Intelligent Robot Innovation Center and Production Base project. This move aims to promote the large-scale application of robots in the high-precision links of the packaging and testing production line. In nearly 40 scenarios, robots will replace human labor, thus bridging the “last mile” for the industrialization and application of robots.

Mutual pursuit leads from a single seed to a bountiful harvest in the garden

Since its establishment in Pukou in 2018, Huatian has continuously “heavily invested” in Nanjing for seven years, successively laying out five projects in Pukou Economic Development Zone, achieving a magnificent transformation from nothing to something and from large to strong

In 2018, Huatian Group invested 8 billion yuan to start the construction of the Huatian Nanjing (Phase I) project in Pukou, which was officially put into production in 2020.
In 2021, Huatian Jiangsu was established and invested 9.95 billion yuan to launch the Huatian (Jiangsu) wafer-level advanced packaging and testing production line project.
In March 2024, Huatian Technology made an additional investment of 10 billion yuan to lay out the Huatian Nanjing (Phase II) project. In May of the same year, the advanced packaging and testing project of Pangu Semiconductor, which is controlled by Huatian Jiangsu, was signed and settled in.
In August 2025, Huatian Advanced was established with an investment of 2 billion yuan, completing the advanced packaging and testing territory.

“Our relationship with Nanjing is like that of fish and water. It’s truly a mutual pursuit.” ” When talking about his seven years in Nanjing, Zhu Yuping said that during the operation of the project, Pukou provided “nanny-style” services throughout the process, responding to every matter in terms of policy support, industrial matching, and daily care, allowing the enterprise to take root with peace of mind and work meticulously.
Regarding the future development of Huatian, Zhu Yuping expressed with great confidence that the seed planted in 2018 has been bearing fruit continuously on the vine, producing one gourd after another. Looking up, there is a bountiful harvest all over the garden. At present, all projects are advancing in parallel. The total planning in Nanjing is 34 billion yuan, and it is expected that a Huatian Industrial City will be built in the future.